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LE58083ABGCT

Telecom device1 Circuits


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-LE58083ABGCT
  • Package: 121-LFBGA
  • Datasheet: PDF
  • Stock: 952
  • Description: Telecom device1 Circuits(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 121-LFBGA
Supplier Device Package 121-LFBGA (10x10)
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Function Subscriber Line Interface Concept (SLIC)
Interface PCI
Number of Circuits 1
RoHS Status Non-RoHS Compliant

LE58083ABGCT Overview


The 121-LFBGA package reduces the amount of space on a board.To pack telecommunications equipment, the way of Tape & Reel (TR) is used.Telecommunications equipment is mounted with type Surface Mount.A 1-circuit composes this telecom IC .A higher supply voltage for 3.3V will improve efficiency.-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.

LE58083ABGCT Features


Available in the 121-LFBGA package

LE58083ABGCT Applications


There are a lot of Microsemi Corporation LE58083ABGCT Telecom applications.

  • T1/E1/J1 Multiplexer and Channel Banks
  • E1 Multiplexer
  • CSU/DSU E1 Interface
  • Digital Access Cross-connect System (DACs)
  • NIU
  • Cable Modem
  • Multichannel DS1 Test Equipment
  • Cross Connects
  • Hybrid fiber coax (HFC)
  • Fiber to the Home (FTTH)