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LE88506DVC

64 Pin Telecom device2 CircuitsMin 3.3V VMax 35V V


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-LE88506DVC
  • Package: TQFP
  • Datasheet: -
  • Stock: 137
  • Description: 64 Pin Telecom device2 CircuitsMin 3.3V VMax 35V V(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TQFP
Number of Pins 64
Supplier Device Package 64-TQFP (10x10)
Weight 360.605934mg
Packaging Tray
Published 2008
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V~35V
Function Telecom Circuit
Number of Channels 2
Interface PCM
Number of Circuits 2
Max Supply Voltage 35V
Min Supply Voltage 3.3V
RoHS Status ROHS3 Compliant

LE88506DVC Overview


Board space can be saved by using the TQFP package.To pack telecommunications equipment, the way of Tray is used.The mounting type of this telecom circuit is Surface Mount.The telecom IC is composed of 2 circuits.When 3.3V~35V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.A Surface Mount-axis mounts telecom switching.There are 64 pins on this telecom interface.The voltage supplied should be 3.3V at least.There should be a lower voltage supplied than 35V.Using 2 channels, it achieves its superior flexibility.

LE88506DVC Features


Available in the TQFP package

LE88506DVC Applications


There are a lot of Microchip Technology LE88506DVC Telecom applications.

  • Public switching systems
  • Home Gateway
  • Integrated Access Devices
  • SDH/SONET multiplexers
  • Cross Connects
  • Interfaces to DS3
  • Integrated Multi-Service Access Platforms (IMAPs)
  • Cable PC
  • T1 Digital Cross Connects (DSX-1)
  • M13 MUX