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  • LE89156PQC

LE89156PQC

48 Pin Telecom device1 CircuitsMin 4.4V VMax 15V V


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-LE89156PQC
  • Package: 48-VQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 705
  • Description: 48 Pin Telecom device1 CircuitsMin 4.4V VMax 15V V(Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 48-VQFN Exposed Pad
Number of Pins 48
Supplier Device Package 48-QFN (7x7)
Weight 150.507618mg
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Max Power Dissipation 1.7W
Voltage - Supply 3.135V~3.465V
Function Telecom Circuit
Number of Channels 1
Interface PCM
Number of Circuits 1
Max Supply Voltage 15V
Min Supply Voltage 4.4V
Radiation Hardening No
RoHS Status ROHS3 Compliant

LE89156PQC Overview


The 48-VQFN Exposed Pad package reduces the amount of space on a board.To pack telecommunications equipment, the way of Tray is used.Telecommunications equipment is mounted using Surface Mount.1 circuits make up this telecom IC .When the voltage for 3.135V~3.465V is provided, improved efficiency can be achieved.Using -40°C~85°C as the operating temperature can result in reliable performance.Surface Mount is the way telecom switching is mounted.There are 48 pins on this telecom interface.A minimum temperature value -40°C is set to ensure normal operation.To ensure normal operation, 85°C is set at maximum.The voltage supplied should be 4.4V at least.If the voltage supplied is lower than 15V, telecommunications device should be used.Flexibility is achieved through 1 channels.

LE89156PQC Features


Available in the 48-VQFN Exposed Pad package

LE89156PQC Applications


There are a lot of Microchip Technology LE89156PQC Telecom applications.

  • ISDN Primary Rate Interface
  • PCM Test Equipment
  • Remote wireless modules
  • Channel Banks
  • Fiber In The Loop (FITL)
  • Central office (CO)
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • T1/E1/J1 LAN/WAN Routers
  • Dual battery supply voltage SLICs
  • Digital Cross-connect Systems (DCS)