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  • LE9502BTCT

LE9502BTCT

44 Terminations3.3V Telecom device1 Circuits


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-LE9502BTCT
  • Package: 44-TQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 272
  • Description: 44 Terminations3.3V Telecom device1 Circuits(Kg)

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Details

Tags

Parameters
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 44-TQFP Exposed Pad
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Published 2002
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 44
Terminal Finish MATTE TIN
Subcategory Analog Transmission Interfaces
Technology BIPOLAR
Terminal Position QUAD
Terminal Form GULL WING
Supply Voltage 3.3V
Terminal Pitch 0.8mm
JESD-30 Code S-PQFP-G44
Function Subscriber Line Interface Concept (SLIC)
Qualification Status Not Qualified
Operating Supply Voltage 3.3V
Interface 2-Wire
Number of Circuits 1
Operating Supply Current 7.5mA
Battery Feed CONSTANT CURRENT
Hybrid 2-4 CONVERSION
RoHS Status RoHS Compliant

LE9502BTCT Overview


44-TQFP Exposed Pad package is used to save board space.For packing, Tape & Reel (TR) is used.Mounting type Surface Mount is used.A 1 circuit is the heart of this telecom IC .The operating temperature set at -40°C~85°C can offer reliable performance.Surface Mount is the way telecom switching is mounted.In telecom switching configuration, there are 44 terminations.It requires a supply voltage of 3.3V.In order to provide designers with a great deal of flexibility, this telecom circuit operates on the supply voltage of 3.3V.Designers have a great deal of flexibility with this telecom circuit due to its operation with the supply current provided by 7.5mA.This is a Analog Transmission Interfaces subcategory.

LE9502BTCT Features


Available in the 44-TQFP Exposed Pad package
Operating supply voltage of 3.3V
Operating supply current of 7.5mA

LE9502BTCT Applications


There are a lot of Microsemi Corporation LE9502BTCT Telecom applications.

  • Switching Systems
  • ATM equipment with integrated DS1 interfaces
  • Fiber In The Loop (FITL)
  • NIU
  • E1 LAN/WAN Routers
  • Wireless base stations
  • T1/E1/J1 Multiplexer and Channel Banks
  • T1/E1/J1 Performance Monitoring
  • E1 Multiplexer
  • Integrated Multi-Service Access Platforms (IMAPs)