LFE2-12SE-6FN484C

LFE2-12SE-6FN484C Overview

A 484-BBGA package contains it, and it is available for download. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 297 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 12000 logic elements/cells. The supply voltage is 1.2V volts. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. This FPGA module can be attached to the development board with a Surface Mount. The supply voltage of the device is 1.14V~1.26V , at which it runs. The ECP2 Series is one of the types of FPGAs that belong to this type. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. In this device, 297 outputs are incorporated in order to provide you with maximum flexibility. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is designed wFpga chipsh 484 terminations. The RAM bits that this device offer is 226304. Its base part number LFE2-12 can be used to find parts that are related to it. Fpga electronics is important that this FPGA module has a RAM si27.6kBe of 27.6kB in order to ensure that the program will run normally. 484 pins are designed into the device. A total of 1500 LABs/CLBs make up this FPGA array. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. A 1.2V-volt supply allows designers to fully utilize its flexibility. I am going to present you with a device that is equipped with 484 pins. Data and programs can be stored in this FPGA module's memory of 30.6kB. It is possible to achieve a speed of up to 320MHz with this FPGA.

LFE2-12SE-6FN484C Features

297 I/Os
Up to 226304 RAM bits
484 LABs/CLBs

LFE2-12SE-6FN484C Applications

There are a lot of Lattice Semiconductor Corporation LFE2-12SE-6FN484C FPGAs applications.

• Industrial IoT
• Radar and Sensors
• Consumer Electronics
• Data Center
• Artificial intelligence (AI)
• Space Applications
• ASIC prototyping
• Ecosystem
• Automotive
• Medical Electronics