LFE2-70E-6FN672C

LFE2-70E-6FN672C Overview

Fpga chips is supplied in the 672-BBGA package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. The device has 500 I/O ports for more coherent data transfer. Logic blocks consist of 68000 logic elements/cells. 1.2V volts power it. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. The Surface Mount-slot connector on the FPGA module can be connected to the development board. With a supply voltage of 1.14V~1.26V, this device operates with ease. This is a type of FPGA that is part of the ECP2 series of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. There are 500 outputs incorporated in this device. As a space-saving measure, this FPGA model is contained within Tray. As a whole, it has 672 terminations. Fpga electronics is worth mentioning that this device provides 1056768 bfpga electronics s of RAM. Its base part number LFE2-70 can be used to find parts that are related to it. The FPGA module's RAM si129kBe reaches 129kB in order to ensure that the program operates in a normal manner. 672 pins are designed into the device. An array of 8500 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. This device has a pin count of 672 in fpga semiconductor. Most of the time, it uses a crystal oscillating at 357MHz to generate the signal. This FPGA module embeds a memory of 146kB available for storing programs and data. As part of the building blocks, it consists of 70000 logic cells.

LFE2-70E-6FN672C Features

500 I/Os
Up to 1056768 RAM bits
672 LABs/CLBs

LFE2-70E-6FN672C Applications

There are a lot of Lattice Semiconductor Corporation LFE2-70E-6FN672C FPGAs applications.

• Defense Applications
• Security systems
• Automotive driver's assistance
• Telecommunication
• Military Temperature
• Data center hardware accelerators
• Integrating multiple SPLDs
• Bioinformatics
• Industrial Ethernet
• Medical imaging