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LFE2-70E-6FN900I

1.2V V 2.6mm mm 146kB B FPGAs ECP2 Series 900-BBGA 1mm mm 900


  • Manufacturer: Lattice Semiconductor Corporation
  • Origchip NO: 477-LFE2-70E-6FN900I
  • Package: 900-BBGA
  • Datasheet: PDF
  • Stock: 955
  • Description: 1.2V V 2.6mm mm 146kB B FPGAs ECP2 Series 900-BBGA 1mm mm 900 (Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 900-BBGA
Number of Pins 900
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2008
Series ECP2
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 900
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number LFE2-70
Pin Count 900
Number of Outputs 583
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Memory Size 146kB
Number of I/O 583
RAM Size 129kB
Clock Frequency 357MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 68000
Total RAM Bits 1056768
Number of LABs/CLBs 8500
Combinatorial Delay of a CLB-Max 0.331 ns
Number of Logic Cells 70000
Height Seated (Max) 2.6mm
Length 31mm
Width 31mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free

LFE2-70E-6FN900I Overview


A 900-BBGA package is provided with this component. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 68000 logic elements/cells. Power is provided by a 1.2V-volt supply. Field Programmable Gate Arrays family FPGA part. The Surface Mount-slot on the development board allows you to attach the FPGA module. The supply voltage of the device is 1.14V~1.26V , at which it runs. This is a type of FPGA that is part of the ECP2 series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. In this device, there are 583 outputs that can be used. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. 900 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1056768 bFpga chipss. In order to find related parts, you can use its base part number LFE2-70. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. The device is designed with 900 pins in total. The FPGA consists of 8500 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Its flexibility can be fully utilized when operating with a 1.2V supply voltage. There are a total of 900 pins on this device. Fpga semiconductor typically uses a crystal oscillating at 357MHz. Data and programs can be stored in this FPGA module's 146kB memory. For the building block, it incorporates 70000 logic cells that are used to make it work.

LFE2-70E-6FN900I Features


583 I/Os
Up to 1056768 RAM bits
900 LABs/CLBs

LFE2-70E-6FN900I Applications


There are a lot of Lattice Semiconductor Corporation LFE2-70E-6FN900I FPGAs applications.

  • Integrating multiple SPLDs
  • Secure Communication
  • Random logic
  • Space Applications
  • Solar Energy
  • Cryptography
  • Automotive Applications
  • Industrial,Medical and Scientific Instruments
  • Video & Image Processing
  • Development Boards and Shields for Microcontrollers