LFE2M100E-7F1152C

LFE2M100E-7F1152C Overview

As part of the 1152-BBGA package, it is included. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. The I/Os are designed to facilitate a more coherent transfer of data. The basic building blocks of logic contain 95000 logic elements/cells. Power is provided by a 1.2V-volt supply. An FPGA part from the Field Programmable Gate Arrays family. An attachment Surface Mount allows the FPGA module to be attached to the development board. This device is powered by a 1.14V~1.26V battery. It is a type of FPGA that belongs to the ECP2M series of FPGAs. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. A total of 520 outputs are incorporated into this device. It is for space saving reasons that this FPGA model is contained in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 5435392 bFpga chipss. Its base part number LFE2M100 can be used to find related parts. This FPGA module has a RAM si663.5kBe of 663.5kB that is sufficient to make sure that the program is able to run normally. The device is designed with 1152 pins in total. The FPGA is built as an array of 11875 latches or CLBs. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Designers can fully utilize its flexibility with 1.2V supply voltage. Normally, fpga semiconductor uses an oscillator, which oscillates at 420MHz, to create the signal. In this FPGA module, there is a memory of 688.8kB that can be used to store programs and data. In order for the building block to work, fpga semiconductor consists of 100000 logic cells.

LFE2M100E-7F1152C Features

520 I/Os
Up to 5435392 RAM bits
1152 LABs/CLBs

LFE2M100E-7F1152C Applications

There are a lot of Lattice Semiconductor Corporation LFE2M100E-7F1152C FPGAs applications.

• Military Temperature
• Data Mining
• Filtering and communication encoding
• Integrating multiple SPLDs
• Security systems
• Automotive Applications
• Wireless Communications
• Camera time adjustments
• ASIC prototyping
• Solar Energy