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LFXP6C-3FN256C

1.8V V 2.1mm mm 11.9kB B FPGAs XP Series 320MHz MHz 256-BGA 1mm mm 256


  • Manufacturer: Lattice Semiconductor Corporation
  • Origchip NO: 477-LFXP6C-3FN256C
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 849
  • Description: 1.8V V 2.1mm mm 11.9kB B FPGAs XP Series 320MHz MHz 256-BGA 1mm mm 256 (Kg)

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Details

Tags

Parameters
Operating Supply Voltage 1.8V
Power Supplies 1.8/2.5/3.3V
Memory Size 11.9kB
Number of I/O 188
RAM Size 9kB
Organization 720 CLBS
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 6000
Total RAM Bits 73728
Combinatorial Delay of a CLB-Max 0.63 ns
Number of CLBs 720
Number of Logic Cells 720
Height Seated (Max) 2.1mm
Length 17mm
Width 17mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-BGA
Number of Pins 256
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2007
Series XP
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.8V
Terminal Pitch 1mm
Frequency 320MHz
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number LFXP6
Pin Count 256
Number of Outputs 188

LFXP6C-3FN256C Overview


In the 256-BGA package, you will find fpga chips. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. There are 188 I/Os for better data transfer. There are 6000 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.8V. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. FPGA modules can be attached to development boards using a Surface Mount-connector. With a supply voltage of 1.71V~3.465V, this device operates with ease. There are many types of FPGAs in the XP series, this is one of them. The operating temperature should be kept at 0°C~85°C TJ when operating. In order to make this device as versatile as possible, there are 188 different outputs included. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has 256 terminations on each end. The RAM bits that are offered by this fpga chips are 73728. In order to find related parts, use the part number LFXP6 as a base. During the configuration of this FPGA module, the RAM si9kBe reaches 9kB to ensure that the program runs normally. The device is designed with 256 pins in total. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. Designers can fully utilize its flexibility with 1.8V supply voltage. Power is supplied to the device by a 1.8/2.5/3.3V battery. This device has a pin count of 256 in fpga semiconductor. Data and programs can be stored in this FPGA module's memory of 11.9kB. For its architecture, 720 CLB modules are used. The system operates at a frequency of 320MHz in order to achieve maximum efficiency. For the building block of this system, 720 logic cells are included.

LFXP6C-3FN256C Features


188 I/Os
Up to 73728 RAM bits
256 LABs/CLBs
Operating from a frequency of 320MHz

LFXP6C-3FN256C Applications


There are a lot of Lattice Semiconductor Corporation LFXP6C-3FN256C FPGAs applications.

  • Integrating multiple SPLDs
  • Medical Applications
  • Space Applications
  • Automotive
  • Embedded Vision
  • Automotive advanced driver assistance systems (ADAS)
  • Artificial intelligence (AI)
  • Cryptography
  • Telecommunication
  • Wired Communications