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M2S005-1VF256

256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 161 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S005-1VF256
  • Package: 256-LFBGA
  • Datasheet: PDF
  • Stock: 273
  • Description: 256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 161 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 256-LFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 161
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 161
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 161
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 5K Logic Modules
Number of Logic Cells 6060
Flash Size 128KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.Package 256-LFBGA is assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series name of this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~85°C TJ.A significant feature of this SoC security is the combination of FPGA - 5K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part has a total of 161 I/Os.A 1.2V power supply should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.It is really beneficial to have system on a chip since there are 256 terminations in total.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.A SoC chip like this can have 161 outputs.A power supply of 1.2V is required to run system on chip.The SoC chip is equipped with 161 inputs.6060 logic cells are present in logic system on chips.As for its flash size, it is 128KB.Moreover, this SoC processor is also equipped with additional features of LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S005-1VF256 System On Chip (SoC) applications.

  • Industrial sectors
  • Industrial automation devices
  • RISC-V
  • Published Paper
  • Mobile computing
  • DC-input BLDC motor drive
  • Cyber security for critical applications in the aerospace
  • Industrial transport
  • Industrial AC-DC
  • Industrial