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  • M2S005S-1TQG144T2

M2S005S-1TQG144T2

0°C~85°C TJ System On ChipSmartFusion?2 Series 213 I/O


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S005S-1TQG144T2
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: 114
  • Description: 0°C~85°C TJ System On ChipSmartFusion?2 Series 213 I/O(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®2
Part Status Active
Number of I/O 213
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 5K Logic Modules
Flash Size 128KB

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Assigned with the package 144-LQFP, this system on a chip comes from the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.This SoC design employs the MCU, FPGA technique for its internal architecture.It is a member of the SmartFusion?2 series.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.It is important to note that this SoC security combines FPGA - 5K Logic Modules.It comes in a state-of-the-art Tray package.This SoC part contains a total of 213 I/Os in total.There is a flash of 128KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
128KB extended flash.

There are a lot of Microsemi Corporation


M2S005S-1TQG144T2 System On Chip (SoC) applications.

  • Apple smart watch
  • RISC-V
  • Industrial automation devices
  • Wireless sensor networks
  • Efficient hardware for inference of neural networks
  • DC-input BLDC motor drive
  • Three phase UPS
  • Central inverter
  • ARM support modules
  • Test and Measurement