All Products

M2S005S-VF400I

400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 169 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S005S-VF400I
  • Package: 400-LFBGA
  • Datasheet: PDF
  • Stock: 260
  • Description: 400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 169 I/O1.2V (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 400-LFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series SmartFusion®2
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B400
Supply Voltage-Max (Vsup) 1.26V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 169
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 5K Logic Modules
Flash Size 128KB
Height Seated (Max) 1.51mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).Its package is 400-LFBGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines FPGA - 5K Logic Modules.An advanced Tray package houses this SoC system on a chip.169 I/Os are available in this SoC part.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.This SoC system on a chip can run on a power supply that is at least 1.14V.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.In total, there are 400 terminations, which makes system on a chip possible.The flash size of the SoC meaning is 128KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
128KB extended flash.

There are a lot of Microsemi Corporation


M2S005S-VF400I System On Chip (SoC) applications.

  • Cyber security for critical applications in the aerospace
  • Central alarm system
  • Transmitters
  • Measurement testers
  • Servo drive control module
  • Robotics
  • Multiprocessor system-on-chips (MPSoCs)
  • Temperature Sensors
  • Special Issue Editors
  • Cyberphysical system-on-chip