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M2S005S-VFG256I

256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 161 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S005S-VFG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 840
  • Description: 256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 161 I/O1.2V (Kg)

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Details

Tags

Parameters
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 161
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 161
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 161
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 5K Logic Modules
Number of Logic Cells 6060
Flash Size 128KB

This SoC is built on ARM? Cortex?-M3 core processor(s).


There are ARM? Cortex?-M3 core processors in this SoC.It has been assigned a package 256-LBGA by its manufacturer for this system on a chip.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.A key point to note is that this SoC security combines FPGA - 5K Logic Modules.Tray package houses this SoC system on a chip.161 I/Os are included in this SoC part.A 1.2V power supply should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.In order to run it, it must be fed by at least 1.14V of power.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.There are 256 terminations in total and that really benefits system on a chip.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.A SoC chip with 161 outputs is available.As far as power supplies are concerned, system on chip requires 1.2V.On the SoC chip, there are 161 inputs available for use.A logic SoC has 6060 logic cells.This flash has a size of 128KB.Further features of this SoC processor are LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S005S-VFG256I System On Chip (SoC) applications.

  • Industrial AC-DC
  • External USB hard disk/SSD
  • Industrial Pressure
  • Body control module
  • Robotics
  • Fitness
  • Vending machines
  • Samsung galaxy gear
  • Communication network-on-Chip (cNoC)
  • Efficient hardware for inference of neural networks