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M2S010-1VFG256

256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010-1VFG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 167
  • Description: 256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells 12084
Flash Size 256KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 256-LBGA.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is part of the SmartFusion?2 series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 10K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.138 I/Os are included in this SoC part.A 1.2V power supply is recommended.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.Power supplies of at least 1.14V are required.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.In total, there are 256 terminations, which makes system on a chip possible.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.You can have 138 user outputs for this SoC chip.In order to use system on chip, you will need a power supply of 1.2V.The SoC chip is equipped with 138 inputs.Logic system on chips consist of 12084 logic cells.A flashing 256KB appears on it.This SoC processor also includes LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S010-1VFG256 System On Chip (SoC) applications.

  • Central alarm system
  • AC-input BLDC motor drive
  • Functional safety for critical applications in the aerospace
  • PC peripherals
  • Efficient hardware for inference of neural networks
  • Wireless networking
  • Sports
  • RISC-V
  • Keyboard
  • High-end PLC