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M2S010S-1TQ144

0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010S-1TQ144
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: 580
  • Description: 0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O(Kg)

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Shipping Cost

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Lifecycle Status OBSOLETE (Last Updated: 1 month ago)
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®2
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 84
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 10K Logic Modules
Flash Size 256KB
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 144-LQFP by the manufacturer.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion?2 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.There is one thing to note about this SoC security: it combines FPGA - 10K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part is comprised of 84 inputs and outputs.A 256KB flash can be seen on it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S010S-1TQ144 System On Chip (SoC) applications.

  • Servo drive control module
  • Sports
  • Cyberphysical system-on-chip
  • Functional safety for critical applications in the aerospace
  • CNC control
  • Communication network-on-Chip (cNoC)
  • Avionics
  • USB hard disk enclosure
  • Wireless networking
  • Published Paper