All Products

M2S010T-1FG484I

-40°C~100°C TJ M2S010T System On ChipSmartFusion?2 Series 233 I/O


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010T-1FG484I
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 393
  • Description: -40°C~100°C TJ M2S010T System On ChipSmartFusion?2 Series 233 I/O(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 484-BGA
Supplier Device Package 484-FPBGA (23x23)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 166MHz
Base Part Number M2S010T
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 233
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes FPGA - 10K Logic Modules
Flash Size 256KB
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.It has been assigned a package 484-BGA by its manufacturer for this system on a chip.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.It is a member of the SmartFusion?2 series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.As one of the most important things to note is that this SoC security combines FPGA - 10K Logic Modules together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.233 I/Os are included in this SoC part.The flash size of the SoC meaning is 256KB.By searching M2S010T, you will find system on chips with similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.In this SoC meaning, ARM serves as the core architecture.In order for the SoC computing to start up, -40°C is sufficient.There is a maximum operating temperature of 100°C set for this SoC system on chip during its design.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S010T-1FG484I System On Chip (SoC) applications.

  • Personal Computers
  • Published Paper
  • Efficient hardware for inference of neural networks
  • Smart appliances
  • Industrial transport
  • Mouse
  • Microprocessors
  • Video Imaging
  • Test and Measurement
  • sequence controllers