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M2S010T-1FG484M

484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 233 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010T-1FG484M
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 527
  • Description: 484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 233 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 days ago)
Package / Case 484-BGA
Surface Mount YES
Operating Temperature -55°C~125°C TJ
Packaging Tray
Published 2016
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code 3A001.A.2.C
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 233
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 233
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 233
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells 12084
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.The manufacturer assigns this system on a chip with a 484-BGA package as per the manufacturer's specifications.With 64KB RAM implemented, this SoC chip provides reliable operation.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series in which this system on chip SoC falls under.It is recommended that this SoC meaning be operated at -55°C~125°C TJ on an average.A key point to note is that this SoC security combines FPGA - 10K Logic Modules.Housed in the state-of-art Tray package.This SoC part contains a total of 233 I/Os in total.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.If it has at least a 1.14V volt power supply, it can work fine.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.In total, there are 484 terminations, so system on a chip is really aided by this.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.The SoC chip that comes with this module can be configured to have 233 outputs.System on chip requires 1.2V power supplies.This SoC chip has a total of 233 inputs that can be used.There are 12084 logic cells in the logic system on chips.The flash size of the SoC meaning is 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S010T-1FG484M System On Chip (SoC) applications.

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