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M2S010T-1VF256I

256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010T-1VF256I
  • Package: 256-LFBGA
  • Datasheet: PDF
  • Stock: 906
  • Description: 256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V (Kg)

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Details

Tags

Parameters
Lifecycle Status IN PRODUCTION (Last Updated: 3 days ago)
Package / Case 256-LFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells 12084
Flash Size 256KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 10 Weeks

This SoC is built on ARM? Cortex?-M3 core processor(s).


On this SoC, there is ARM? Cortex?-M3 core processor.Assigned with the package 256-LFBGA, this system on a chip comes from the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.The SoC design uses MCU, FPGA architecture for its internal architecture.The system on a chip is part of the series SmartFusion?2.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.There is one thing to note about this SoC security: it combines FPGA - 10K Logic Modules.An advanced Tray package houses this SoC system on a chip.This SoC part contains a total of 138 I/Os in total.Use a power supply with a voltage of 1.2V if possible.In the SoCs wireless, voltages above 1.26V are considered unsafe.In order to run it, it must be fed by at least 1.14V of power.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.Having 256 terminations in total makes system on a chip possible.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.Using this SoC chip, you have the option of having 138 outputs.A power supply of 1.2V is required.The SoC chip offers 138 inputs.In logic system on chips, there are 12084 logic cells.This flash has a size of 256KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S010T-1VF256I System On Chip (SoC) applications.

  • Flow Sensors
  • Smart appliances
  • Networked sensors
  • PC peripherals
  • Medical Pressure
  • Mobile market
  • Medical
  • Transmitters
  • Personal Computers
  • AC-input BLDC motor drive