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M2S010TS-1FG484

0°C~85°C TJ System On ChipSmartFusion?2 Series 233 I/O

Manufacturer: Microsemi Corporation
Origchip NO: 523-M2S010TS-1FG484
Package: 484-BGA
Datasheet: PDF
Stock: 116
Description: 0°C~85°C TJ System On ChipSmartFusion?2 Series 233 I/O(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time	10 Weeks
Package / Case	484-BGA
Supplier Device Package	484-FPBGA (23x23)
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Published	2015
Series	SmartFusion®2
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of I/O	233
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Primary Attributes	FPGA - 10K Logic Modules
Flash Size	256KB
RoHS Status	Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).

A core processor ARM? Cortex?-M3 is embedded in this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.A system on chip SoC of this type belongs to the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.A key point to note is that this SoC security combines FPGA - 10K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.233 I/Os are available in this SoC part.The flash is set to 256KB.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

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