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M2S010TS-1FG484M

484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 233 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010TS-1FG484M
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 331
  • Description: 484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 233 I/O1.2V (Kg)

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Details

Tags

Parameters
Number of Terminations 484
ECCN Code 3A001.A.2.C
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 233
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 233
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 233
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells 12084
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 10 Weeks
Package / Case 484-BGA
Surface Mount YES
Operating Temperature -55°C~125°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.The manufacturer assigns this system on a chip with a 484-BGA package as per the manufacturer's specifications.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -55°C~125°C TJ on average.In addition, this SoC security combines FPGA - 10K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.In total, this SoC part has 233 I/Os.It is recommended to use a 1.2V power supply.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.As long as it receives a power supply that is at least 1.14V, it should be able to function.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.As a result, there are 484 terminations in total, which does really benefit system on a chip.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.Using this SoC chip, you have the option of having 233 outputs.There is 1.2V power supply requirement for this system on chip SoC.This SoC chip is equipped with 233 inputs for the user to choose from.A logic SoC has 12084 logic cells.This flash has a size of 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S010TS-1FG484M System On Chip (SoC) applications.

  • Industrial robot
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  • Optical drive
  • Robotics
  • Digital Signal Processing
  • Vending machines
  • Functional safety for critical applications in the aerospace
  • Cyberphysical system-on-chip
  • Industrial Pressure
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