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M2S010TS-1FGG484M

484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 233 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010TS-1FGG484M
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 239
  • Description: 484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 233 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Package / Case 484-BGA
Surface Mount YES
Operating Temperature -55°C~125°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code 3A001.A.2.C
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 233
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 233
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 233
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells 12084
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.The average operating temps for this SoC meaning should be -55°C~125°C TJ.A significant feature of this SoC security is the combination of FPGA - 10K Logic Modules.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 233 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supplies of at least 1.14V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.The system on a chip uses 484 terminations in total.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.A SoC chip like this can have 233 outputs.As far as power supplies are concerned, system on chip requires 1.2V.A SoC chip with 233 inputs is available.System on chips of logic are comprised of 12084 logic cells.As for its flash size, it is 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S010TS-1FGG484M System On Chip (SoC) applications.

  • CNC control
  • Keyboard
  • Avionics
  • Industrial transport
  • Mouse
  • Networked sensors
  • Remote control
  • System-on-chip (SoC)
  • ARM Cortex M4 microcontroller
  • Embedded systems