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M2S010TS-1VF256

256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010TS-1VF256
  • Package: 256-LFBGA
  • Datasheet: PDF
  • Stock: 212
  • Description: 256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Package / Case 256-LFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells 12084
Flash Size 256KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.There is a 256-LFBGA package assigned to this system on a chip by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.This SoC security combines FPGA - 10K Logic Modules, an important feature to keep in mind.Tray package houses this SoC system on a chip.This SoC part has a total of 138 I/Os.A 1.2V power supply should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.There is a possibility that it can be powered by a power supply of at least 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.Having 256 terminations in total makes system on a chip possible.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.A SoC chip with 138 outputs is available.You will need to provide 1.2V power supplies in order to run system on chip.There are 138 inputs available on the SoC chip.Logic system on chips consist of 12084 logic cells.The flash size of the SoC meaning is 256KB.Moreover, this SoC processor comes with LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S010TS-1VF256 System On Chip (SoC) applications.

  • Automotive
  • DC-input BLDC motor drive
  • Self-aware system-on-chip (SoC)
  • Medical Pressure
  • Special Issue Information
  • Automated sorting equipment
  • Defense
  • Digital Media
  • Video Imaging
  • Medical