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M2S025-1FCS325I

325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025-1FCS325I
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 624
  • Description: 325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 180
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.There is a 325-TFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Featured system on chip SoCs of the SmartFusion?2 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 25K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part is comprised of 180 inputs and outputs.A power supply with a 1.2V rating is recommended.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.At least 1.14V can be supplied as a power source.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.It is really beneficial to have system on a chip since there are 325 terminations in total.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.There are 180 outputs available on this SoC.In order to operate system on chip, you will need 1.2V power supplies.The SoC chip offers 180 inputs.A logic SoC has 27696 logic cells.A 256KB flash can be seen on it.This SoC processor also includes LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025-1FCS325I System On Chip (SoC) applications.

  • Central alarm system
  • Medical
  • ARM support modules
  • Special Issue Editors
  • Microcontroller
  • Sports
  • Deep learning hardware
  • Functional safety for critical applications in the automotive
  • Networked sensors
  • Industrial AC-DC