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M2S025-1FCSG325

325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025-1FCSG325
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 845
  • Description: 325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 180
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Assigned with the package 325-TFBGA, CSPBGA, this system on a chip comes from the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.This SoC security combines FPGA - 25K Logic Modules, an important feature to keep in mind.There is a state-of-the-art Tray package that houses this SoC system on a chip.180 I/Os are included in this SoC part.A power supply with a 1.2V rating is recommended.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.In order to run it, it must be fed by at least 1.14V of power.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 325 terminations, so system on a chip is really aided by this.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.A SoC chip with 180 outputs is available.In order to use system on chip, you will need a power supply of 1.2V.The SoC chip is equipped with 180 inputs.A logic SoC has 27696 logic cells.This flash has a size of 256KB.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025-1FCSG325 System On Chip (SoC) applications.

  • Deep learning hardware
  • External USB hard disk/SSD
  • Smart appliances
  • Embedded systems
  • Mouse
  • Video Imaging
  • CNC control
  • Industrial
  • Transmitters
  • Level