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M2S025-FCS325

325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025-FCS325
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 443
  • Description: 325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 13 Weeks
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 180
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.This SoC design employs the MCU, FPGA technique for its internal architecture.SmartFusion?2 is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.Taking note of the fact that this SoC security combines FPGA - 25K Logic Modules is important.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 180 I/Os.It is advised to utilize a 1.2V power supply.There is no safe voltage for the SoCs wireless above 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.In total, there are 325 terminations, so system on a chip is really aided by this.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.A SoC chip with 180 outputs is available.A power supply of 1.2V is required.There are 180 inputs available on the SoC chip.The logic system on chips contain 27696 logic cells.A 256KB flash can be seen on it.This SoC processor also includes LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025-FCS325 System On Chip (SoC) applications.

  • Special Issue Information
  • Industrial Pressure
  • Central alarm system
  • Digital Signal Processing
  • ARM support modules
  • Networked sensors
  • Published Paper
  • Microcontroller based SoC ( RISC-V, ARM)
  • Efficient hardware for inference of neural networks
  • Industrial robot