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M2S025-FCSG325I

325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025-FCSG325I
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 267
  • Description: 325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V (Kg)

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Details

Tags

Parameters
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status RoHS Compliant
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 180
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion?2 is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.One important thing to mark down is that this SoC meaning combines FPGA - 25K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 180 I/Os.A power supply with a 1.2V rating is recommended.There is no safe voltage for the SoCs wireless above 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.There are 325 terminations in total and that really benefits system on a chip.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.Using this SoC chip, you have the option of having 180 outputs.There is 1.2V power supply requirement for this system on chip SoC.This SoC chip is equipped with 180 inputs for the user to choose from.A logic SoC has 27696 logic cells.The flash is set to 256KB.This SoC processor also includes LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025-FCSG325I System On Chip (SoC) applications.

  • Industrial robot
  • CNC control
  • Automated sorting equipment
  • Remote control
  • Apple smart watch
  • ARM Cortex M4 microcontroller
  • Digital Signal Processing
  • Industrial AC-DC
  • Measurement tools
  • Deep learning hardware