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M2S025-FGG484I

484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025-FGG484I
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 539
  • Description: 484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 3 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 484-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2014
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 267
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 267
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 267
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.The manufacturer assigns this system on a chip with a 484-BGA package as per the manufacturer's specifications.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion?2 is the series number of this system on chip SoC.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 25K Logic Modules.Tray package houses this SoC system on a chip.267 I/Os in total are included in this SoC part.A power supply with a 1.2V rating is recommended.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.Having 484 terminations in total makes system on a chip possible.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.A SoC chip with 267 outputs is available.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 267 inputs.The logic system on chips contain 27696 logic cells.The flash size of the SoC meaning is 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S025-FGG484I System On Chip (SoC) applications.

  • Communication interfaces ( I2C, SPI )
  • System-on-chip (SoC)
  • Apple smart watch
  • Flow Sensors
  • Robotics
  • Fitness
  • Temperature
  • AC drive control module
  • Samsung galaxy gear
  • Temperature Sensors