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M2S025T-1FCS325I

325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025T-1FCS325I
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 855
  • Description: 325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 180
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.This system on a chip is packaged as 325-TFBGA, CSPBGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 25K Logic Modules together.This SoC system on a chip has been designed in a state-of-the-art Tray package.180 I/Os in total are included in this SoC part.It is recommended to use a 1.2V power supply.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.Power supply should be at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 325 terminations, which makes system on a chip possible.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.There is the option to have 180 outputs on this SoC chip.A power supply of 1.2V is required.A SoC chip with 180 inputs is available to the user.The logic SoC features 27696 logic cells.As for its flash size, it is 256KB.Aside from that, this SoC processor features LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025T-1FCS325I System On Chip (SoC) applications.

  • Measurement testers
  • Cyber security for critical applications in the aerospace
  • PC peripherals
  • Central alarm system
  • Wireless sensor networks
  • Medical
  • String inverter
  • Transmitters
  • Apple smart watch
  • Vending machines