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M2S025T-1VFG256

256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025T-1VFG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 367
  • Description: 256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Its package is 256-LBGA.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 25K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part contains a total of 138 I/Os in total.Use a power supply with a voltage of 1.2V if possible.There is no safe voltage for the SoCs wireless above 1.26V.At least 1.14V can be supplied as a power source.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.As a result, there are 256 terminations in total, which does really benefit system on a chip.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.There are 138 outputs available on this SoC.System on chip requires 1.2V power supplies.A SoC chip with 138 inputs is available to the user.27696 logic cells are present in logic system on chips.There is a flash of 256KB.Further features of this SoC processor are LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025T-1VFG256 System On Chip (SoC) applications.

  • Level
  • Smart appliances
  • Networked sensors
  • Test and Measurement
  • Robotics
  • Automotive
  • Efficient hardware for training of neural networks
  • Cyber security for critical applications in the aerospace
  • Medical
  • Embedded systems