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M2S025T-FCS325I

325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025T-FCS325I
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 962
  • Description: 325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 180
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


On this SoC, there is ARM? Cortex?-M3 core processor.Package 325-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.In the SmartFusion?2 series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.One important thing to mark down is that this SoC meaning combines FPGA - 25K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.In total, this SoC part has 180 I/Os.Ideally, a power supply with a voltage of 1.2V should be used.It is unsafe to operate the SoCs wireless at voltages above 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.In total, there are 325 terminations, which is great for system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 180 outputs, which is convenient.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 180 inputs available for use.System on chips of logic are comprised of 27696 logic cells.There is a flash of 256KB.Additionally, this SoC processor features LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025T-FCS325I System On Chip (SoC) applications.

  • Communication network-on-Chip (cNoC)
  • Mobile market
  • DC-input BLDC motor drive
  • Wireless sensor networks
  • Smart appliances
  • Industrial Pressure
  • Self-aware system-on-chip (SoC)
  • Automotive
  • USB hard disk enclosure
  • Functional safety for critical applications in the industrial sectors