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M2S025TS-1FGG484

0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O

Manufacturer: Microsemi Corporation
Origchip NO: 523-M2S025TS-1FGG484
Package: 484-BGA
Datasheet: PDF
Stock: 515
Description: 0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O(Kg)

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Delivery Time

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time	10 Weeks
Lifecycle Status	IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case	484-BGA
Supplier Device Package	484-FPBGA (23x23)
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Published	2015
Series	SmartFusion®2
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of I/O	267
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Primary Attributes	FPGA - 25K Logic Modules
Flash Size	256KB
RoHS Status	RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).

This SoC is built on ARM? Cortex?-M3 core processor(s).Assigned with the package 484-BGA, this system on a chip comes from the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 25K Logic Modules.It is packaged in a state-of-the-art Tray package.267 I/Os are available in this SoC part.There is a flash of 256KB.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation

M2S025TS-1FGG484 System On Chip (SoC) applications.

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