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M2S025TS-1VFG256

256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025TS-1VFG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 755
  • Description: 256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V (Kg)

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Details

Tags

Parameters
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 256-LBGA package as per the manufacturer's specifications.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion?2 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.In addition, this SoC security combines FPGA - 25K Logic Modules.Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 138 inputs and outputs.A 1.2V power supply should be used.In the SoCs wireless, voltages above 1.26V are considered unsafe.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.There are 256 terminations in total and that really benefits system on a chip.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.There are 138 outputs available on this SoC.A power supply of 1.2V is required.A SoC chip with 138 inputs is available.In logic system on chips, there are 27696 logic cells.This flash has a size of 256KB.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025TS-1VFG256 System On Chip (SoC) applications.

  • Three phase UPS
  • Smartphone accessories
  • Body control module
  • AC-input BLDC motor drive
  • Sensor network-on-chip (sNoC)
  • Industrial automation devices
  • Medical
  • Fitness
  • Servo drive control module
  • ARM Cortex M4 microcontroller