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M2S025TS-FCSG325I

325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025TS-FCSG325I
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 498
  • Description: 325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 180
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


There are ARM? Cortex?-M3 core processors in this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion?2.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.In addition, this SoC security combines FPGA - 25K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 180 I/Os.Use a power supply with a voltage of 1.2V if possible.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.Power supplies of at least 1.14V are required.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.system on a chip benefits from 325 terminations.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.You can have 180 user outputs for this SoC chip.There is 1.2V power supply requirement for this system on chip SoC.This SoC chip has a total of 180 inputs that can be used.There are 27696 logic cells in the logic system on chips.It has a 256KB flash.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025TS-FCSG325I System On Chip (SoC) applications.

  • Measurement testers
  • Industrial robot
  • Defense
  • Smart appliances
  • POS Terminals
  • Efficient hardware for training of neural networks
  • Personal Computers
  • Test and Measurement
  • Industrial automation devices
  • Flow Sensors