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M2S025TS-FGG484I

484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025TS-FGG484I
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 796
  • Description: 484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case 484-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 267
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 267
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 267
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A ARM? Cortex?-M3 core processor(s) is built into this SoC.This system on a chip is packaged as 484-BGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 25K Logic Modules is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 267 I/Os.Use a power supply with a voltage of 1.2V if possible.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.system on a chip benefits from 484 terminations.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.A SoC chip like this can have 267 outputs.There is 1.2V power supply requirement for this system on chip SoC.On the SoC chip, there are 267 inputs available for use.Logic system on chips features 27696 logic cells.The flash size of the SoC meaning is 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


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