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M2S025TS-VF256

256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025TS-VF256
  • Package: 256-LFBGA
  • Datasheet: PDF
  • Stock: 909
  • Description: 256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case 256-LFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.Assigned with the package 256-LFBGA, this system on a chip comes from the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is part of the SmartFusion?2 series of system on a chips.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 25K Logic Modules.Tray package houses this SoC system on a chip.As a whole, this SoC part includes 138 I/Os.It is advised to utilize a 1.2V power supply.It is unsafe to operate the SoCs wireless at voltages above 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.In total, there are 256 terminations, so system on a chip is really aided by this.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.In order for this SoC chip to work properly, you can have 138 outputs.System on chip requires 1.2V power supplies.The SoC chip is equipped with 138 inputs.27696 logic cells are present in logic system on chips.There is a flash of 256KB.Moreover, this SoC processor comes with LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025TS-VF256 System On Chip (SoC) applications.

  • System-on-chip (SoC)
  • Video Imaging
  • Networked sensors
  • Multiprocessor system-on-chips (MPSoCs)
  • sequence controllers
  • Measurement tools
  • Automotive gateway
  • Industrial transport
  • Industrial
  • Self-aware system-on-chip (SoC)