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M2S025TS-VF400I

400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025TS-VF400I
  • Package: 400-LFBGA
  • Datasheet: PDF
  • Stock: 536
  • Description: 400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case 400-LFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B400
Number of Outputs 207
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 207
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 207
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.51mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.The manufacturer assigns this system on a chip with a 400-LFBGA package as per the manufacturer's specifications.With 64KB RAM implemented, this SoC chip provides users with reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.Taking note of the fact that this SoC security combines FPGA - 25K Logic Modules is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.In total, this SoC part has 207 I/Os.A 1.2V power supply should be used.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.As long as it receives a power supply that is at least 1.14V, it should be able to function.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.In total, there are 400 terminations, so system on a chip is really aided by this.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.There is the option to have 207 outputs on this SoC chip.A power supply of 1.2V is required.A SoC chip with 207 inputs is available to the user.Logic system on chips features 27696 logic cells.There is a flash of 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S025TS-VF400I System On Chip (SoC) applications.

  • USB hard disk enclosure
  • RISC-V
  • Automated sorting equipment
  • Deep learning hardware
  • Optical drive
  • AC drive control module
  • Keywords
  • Functional safety for critical applications in the aerospace
  • Central inverter
  • Industrial automation devices