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M2S050-1FGG896

0°C~85°C TJ M2S050 System On ChipSmartFusion?2 Series 377 I/O


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S050-1FGG896
  • Package: 896-BGA
  • Datasheet: PDF
  • Stock: 936
  • Description: 0°C~85°C TJ M2S050 System On ChipSmartFusion?2 Series 377 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 896-BGA
Supplier Device Package 896-FBGA (31x31)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 166MHz
Base Part Number M2S050
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 377
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes FPGA - 50K Logic Modules
Flash Size 256KB
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).There is a 896-BGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.It is part of the SmartFusion?2 series of system on a chips.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of FPGA - 50K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 377.There is a flash of 256KB on it.Searching M2S050 will bring up system on chips with similar specs and purposes.The wireless SoC works at a frequency of 166MHz.The SoC meaning is based on the core architecture of ARM.In order for the SoC computing to start up, 0°C is sufficient.There is an operating temperature limit of 85°C which is the maximum operating temperature designed for this SoC system on chip.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S050-1FGG896 System On Chip (SoC) applications.

  • Vending machines
  • Industrial automation devices
  • Mobile market
  • Medical Pressure
  • Defense
  • Networked sensors
  • Industrial Pressure
  • Wireless networking
  • Networked Media Encode/Decode
  • Functional safety for critical applications in the automotive