M2S050-1FGG896I

This SoC is built on ARM? Cortex?-M3 core processor(s).

A ARM? Cortex?-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 896-BGA package as per the manufacturer's specifications.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the SmartFusion?2 series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines FPGA - 50K Logic Modules.Housed in the state-of-art Tray package.377 I/Os are included in this SoC part.It has a 256KB flash.Search M2S050 for system on chips with similar specs and purposes.166MHz is the wireless SoC's frequency.It uses ARM as its core architecture.It is just enough to start the SoC computing at -40°C.In this SoC system on chip, 100°C represents its maximum operating temperature.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S050-1FGG896I System On Chip (SoC) applications.

• Keywords
• Wireless networking
• Transmitters
• Automotive gateway
• Sports
• ARM Cortex M4 microcontroller
• Measurement tools
• Microprocessors
• Industrial sectors
• PC peripherals