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M2S050-FGG896I

896 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 377 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S050-FGG896I
  • Package: 896-BGA
  • Datasheet: PDF
  • Stock: 981
  • Description: 896 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 377 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case 896-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 896
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B896
Number of Outputs 377
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 377
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 377
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 50K Logic Modules
Number of Logic Cells 56340
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 31mm
Width 31mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Assigned with the package 896-BGA, this system on a chip comes from the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.Internally, this SoC design uses the MCU, FPGA technique.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.This SoC security combines FPGA - 50K Logic Modules, an important feature to keep in mind.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 377 I/Os in total.Ideally, a power supply with a voltage of 1.2V should be used.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.There is a possibility that it can be powered by a power supply of at least 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.Having 896 terminations in total makes system on a chip possible.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 377 outputs, which is convenient.You will need to provide 1.2V power supplies in order to run system on chip.The SoC chip offers 377 inputs.A logic SoC has 56340 logic cells.It has a 256KB flash.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S050-FGG896I System On Chip (SoC) applications.

  • RISC-V
  • AC-input BLDC motor drive
  • PC peripherals
  • Video Imaging
  • Central alarm system
  • Avionics
  • Medical
  • ARM Cortex M4 microcontroller
  • System-on-chip (SoC)
  • Three phase UPS