M2S050TS-1FGG896I

This SoC is built on ARM? Cortex?-M3 core processor(s).

Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.The manufacturer assigns this system on a chip with a 896-BGA package.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series in which this system on chip SoC falls under.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.A key point to note is that this SoC security combines FPGA - 50K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 377 inputs and outputs.This flash has a size of 256KB.A search for M2S050TS will result in system on chips that have similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.-40°C is just enough for the SoC computing to start up.As designed, this SoC system on chip can operate at a maximum temperature of 100°C.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S050TS-1FGG896I System On Chip (SoC) applications.

• Fitness
• Smart appliances
• Efficient hardware for training of neural networks
• Microprocessors
• sequence controllers
• USB hard disk enclosure
• Flow Sensors
• Vending machines
• Print Special Issue Flyer
• Medical Pressure