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M2S050TS-1VFG400

0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O

Manufacturer: Microsemi Corporation
Origchip NO: 523-M2S050TS-1VFG400
Package: 400-LFBGA
Datasheet: PDF
Stock: 220
Description: 0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time	10 Weeks
Lifecycle Status	IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case	400-LFBGA
Supplier Device Package	400-VFBGA (17x17)
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Published	2015
Series	SmartFusion®2
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of I/O	207
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Primary Attributes	FPGA - 50K Logic Modules
Flash Size	256KB
RoHS Status	RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).

On this SoC, there is ARM? Cortex?-M3 core processor.The manufacturer assigns this system on a chip with a 400-LFBGA package as per the manufacturer's specifications.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.Taking note of the fact that this SoC security combines FPGA - 50K Logic Modules is important.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part has a total of 207 I/Os.A flashing 256KB appears on it.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

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