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M2S050TS-FGG896I

896 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 377 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S050TS-FGG896I
  • Package: 896-BGA
  • Datasheet: PDF
  • Stock: 157
  • Description: 896 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 377 I/O1.2V (Kg)

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Details

Tags

Parameters
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B896
Number of Outputs 377
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 377
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 377
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 50K Logic Modules
Number of Logic Cells 56340
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 31mm
Width 31mm
RoHS Status RoHS Compliant
Factory Lead Time 8 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case 896-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 896
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01

This SoC is built on ARM? Cortex?-M3 core processor(s).


A ARM? Cortex?-M3 core processor(s) is built into this SoC.This system on a chip is packaged as 896-BGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.As one of the most important things to note is that this SoC security combines FPGA - 50K Logic Modules together.It comes in a state-of-the-art Tray package.This SoC part contains a total of 377 I/Os in total.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.Power supplies of at least 1.14V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.As a result, there are 896 terminations in total, which does really benefit system on a chip.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 377 outputs.As far as power supplies are concerned, system on chip requires 1.2V.This SoC chip has a total of 377 inputs that can be used.56340 logic cells are included in logic system on chips.The flash is set to 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S050TS-FGG896I System On Chip (SoC) applications.

  • Print Special Issue Flyer
  • System-on-chip (SoC)
  • Measurement testers
  • Cyber security for critical applications in the aerospace
  • External USB hard disk/SSD
  • Communication interfaces ( I2C, SPI )
  • USB hard disk enclosure
  • Cyberphysical system-on-chip
  • Smart appliances
  • Microcontroller