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M2S060-1FCS325

325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060-1FCS325
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 128
  • Description: 325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 200
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 200
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 200
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


On this SoC, there is ARM? Cortex?-M3 core processor.There is a 325-TFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.There is one thing to note about this SoC security: it combines FPGA - 60K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.As a whole, this SoC part includes 200 I/Os.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.There is no safe voltage for the SoCs wireless above 1.26V.In order to run it, it must be fed by at least 1.14V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.In total, there are 325 terminations, so system on a chip is really aided by this.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 200 outputs.A power supply of 1.2V is required to run system on chip.The SoC chip is equipped with 200 inputs.There are 56520 logic cells in the logic system on chips.The flash size of the SoC meaning is 256KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S060-1FCS325 System On Chip (SoC) applications.

  • Functional safety for critical applications in the industrial sectors
  • POS Terminals
  • Multiprocessor system-on-chips (MPSoCs)
  • ARM processors
  • Industrial automation devices
  • Microprocessors
  • USB hard disk enclosure
  • Mobile computing
  • Self-aware system-on-chip (SoC)
  • Smartphones