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M2S060-1FG676I

-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O

Manufacturer: Microsemi Corporation
Origchip NO: 523-M2S060-1FG676I
Package: 676-BGA
Datasheet: PDF
Stock: 759
Description: -40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O(Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Factory Lead Time	10 Weeks
Lifecycle Status	IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case	676-BGA
Supplier Device Package	676-FBGA (27x27)
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2015
Series	SmartFusion®2
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of I/O	387
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Primary Attributes	FPGA - 60K Logic Modules
Flash Size	256KB
RoHS Status	Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).

A core processor ARM? Cortex?-M3 is used to build this SoC.Manufacturer assigns package 676-BGA to this system on a chip.A 64KB RAM SoC chip provides reliable performance to users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 60K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 387.This flash has a size of 256KB.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

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