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M2S060-FCSG325

325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060-FCSG325
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 136
  • Description: 325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 200
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 200
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 200
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.Package 325-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.A MCU, FPGA technique is used for the SoC design's internal architecture.A system on chip SoC of this type belongs to the SmartFusion?2 series.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.A significant feature of this SoC security is the combination of FPGA - 60K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 200 I/Os.A 1.2V power supply is recommended.It is unsafe to operate the SoCs wireless at voltages above 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.There are 325 terminations in total and that really benefits system on a chip.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.It is possible to use this SoC chip with 200 outputs.This system on chip SoC requires 1.2V power supply at all.Inputs are available on the SoC chip in the number of 200.In logic system on chips, there are 56520 logic cells.There is a flash of 256KB.Aside from that, this SoC processor features LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S060-FCSG325 System On Chip (SoC) applications.

  • Functional safety for critical applications in the automotive
  • Smart appliances
  • Self-aware system-on-chip (SoC)
  • Smart appliances
  • Optical drive
  • Communication interfaces ( I2C, SPI )
  • Fitness
  • Automotive
  • Measurement testers
  • Cyber security for critical applications in the aerospace