M2S060-FCSG325I

This SoC is built on ARM? Cortex?-M3 core processor(s).

A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Its package is 325-TFBGA, CSPBGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The system on a chip is part of the series SmartFusion?2.The average operating temps for this SoC meaning should be -40°C~100°C TJ.In addition, this SoC security combines FPGA - 60K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.In total, this SoC part has 200 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.In the SoCs wireless, voltages above 1.26V are considered unsafe.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.Having 325 terminations in total makes system on a chip possible.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.A SoC chip with 200 outputs is available.The logic system on chips contain 56520 logic cells.There is a flash of 256KB.Additionally, this SoC processor features LG-MIN, WD-MIN.There is a 325-pin version of this computer SoC available.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation

M2S060-FCSG325I System On Chip (SoC) applications.

• Functional safety for critical applications in the aerospace
• Avionics
• Digital Signal Processing
• High-end PLC
• POS Terminals
• ARM
• Cyber security for critical applications in the aerospace
• Embedded systems
• Video Imaging
• AC-input BLDC motor drive