M2S060-FGG676

This SoC is built on ARM? Cortex?-M3 core processor(s).

This SoC is built on ARM? Cortex?-M3 core processor(s).This system on a chip is packaged as 676-BGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.In the SmartFusion?2 series, this system on chip SoC is included.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 60K Logic Modules, an important feature to keep in mind.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part is comprised of 387 inputs and outputs.It is advised to utilize a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.The system on a chip uses 676 terminations in total.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.A SoC chip with 387 outputs is available.This system on chip SoC requires 1.2V power supply at all.A SoC chip with 387 inputs is available to the user.A logic SoC has 56520 logic cells.A 256KB flash can be seen on it.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation

M2S060-FGG676 System On Chip (SoC) applications.

• Wireless networking
• Smartphones
• Measurement testers
• Personal Computers
• External USB hard disk/SSD
• Special Issue Information
• POS Terminals
• DC-input BLDC motor drive
• ARM
• Level