M2S060-FGG676I

This SoC is built on ARM? Cortex?-M3 core processor(s).

A core processor ARM? Cortex?-M3 is used to build this SoC.This system on a chip is packaged as 676-BGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.Internally, this SoC design uses the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.The average operating temps for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 60K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 387 I/Os in total.A 1.2V power supply is recommended.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.There is a possibility that it can be powered by a power supply of at least 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.Having 676 terminations in total makes system on a chip possible.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 387 outputs, which is convenient.There is 1.2V power supply required for system on chip.A SoC chip with 387 inputs is available to the user.The logic SoC features 56520 logic cells.A flashing 256KB appears on it.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation

M2S060-FGG676I System On Chip (SoC) applications.

• Video Imaging
• Functional safety for critical applications in the automotive
• Functional safety for critical applications in the industrial sectors
• Smart appliances
• Keyboard
• Cyberphysical system-on-chip
• External USB hard disk/SSD
• POS Terminals
• ARM Cortex M4 microcontroller
• Digital Signal Processing