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M2S060T-1FG676I

676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060T-1FG676I
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 695
  • Description: 676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 676-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Number of Outputs 387
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 387
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 387
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 27mm
Width 27mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 676-BGA package as per the manufacturer's specifications.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.This SoC security combines FPGA - 60K Logic Modules, an important feature to keep in mind.Housed in the state-of-art Tray package.Total I/Os on this SoC part are 387.A 1.2V power supply is recommended.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 676 terminations, which makes system on a chip possible.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 387 outputs.A power supply of 1.2V is required.This SoC chip is equipped with 387 inputs for the user to choose from.Logic system on chips features 56520 logic cells.As for its flash size, it is 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060T-1FG676I System On Chip (SoC) applications.

  • sequence controllers
  • Vending machines
  • ARM Cortex M4 microcontroller
  • Sports
  • Central inverter
  • Automated sorting equipment
  • Central alarm system
  • Industrial automation devices
  • Cyberphysical system-on-chip
  • Networked sensors