M2S060T-1FGG676I

This SoC is built on ARM? Cortex?-M3 core processor(s).

On this SoC, there is ARM? Cortex?-M3 core processor.There is a 676-BGA package assigned to this system on a chip by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion?2 is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.A key point to note is that this SoC security combines FPGA - 60K Logic Modules.It comes in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 387 I/Os.Use a power supply with a voltage of 1.2V if possible.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.It can feed on a power supply of at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 676 terminations, so system on a chip is really aided by this.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.There are 387 outputs available on this SoC.There is 1.2V power supply required for system on chip.This SoC chip is equipped with 387 inputs for the user to choose from.56520 logic cells are included in logic system on chips.A flashing 256KB appears on it.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation

M2S060T-1FGG676I System On Chip (SoC) applications.

• Temperature Sensors
• Communication interfaces ( I2C, SPI )
• sequence controllers
• Special Issue Editors
• CNC control
• Smartphone accessories
• Medical
• Digital Media
• Functional safety for critical applications in the aerospace
• Industrial AC-DC